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Jump in the conduction heat flux at the gas/solid interface in micro-channels

Abstract : In mi­cro-chan­nel gas flows, ve­loc­ity slip and tem­per­a­ture jump must be ap­plied at the fluid/​solid in­ter­face to take the ther­mo­dy­namic non-equi­lib­rium into ac­count in the vicin­ity of the wall. In this work, sim­u­la­tions at mol­e­c­u­lar scale have been car­ried out and shown a jump in the con­duc­tion heat flux, in agree­ment with the bound­ary con­di­tion pro­posed by Maslen (1958) in con­tin­uum me­chan­ics.
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Contributor : Benoît Trouette <>
Submitted on : Friday, September 4, 2020 - 4:10:31 PM
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Dahia Chibouti, Benoît Trouette, Eric Chénier. Jump in the conduction heat flux at the gas/solid interface in micro-channels. International Journal of Thermal Sciences, Elsevier, 2021, 159. ⟨hal-02930894⟩

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